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Wendi K
@packagingeng_id
Level 1
Industrial Packaging Structural Engineer, ArtiosCAD Dieline Specialist
Indonesien
Englisch, Indonesisch
Über mich
Structural Packaging Engineer with 12+ years at two global leaders: Asia
Pulp & Paper (APP) and Tri-Wall (Japan).
I create precise, manufacturing-ready dielines using ArtiosCAD. Whether
standard RSC boxes, complex mailers, or heavy-duty industrial packaging,
I engineer solutions ready for immediate production.
Deep expertise: Material properties (E-flute, B-flute, Triple Wall),
structural integrity, cost optimization, and international compliance
(FEFCO/ECMA).
Your packaging isn't just design—it's engineered for factory success. Fast turnaround.
Message me your specifications.
Kompetenzen

Wendi K
offline •
Durchschnittliche Antwortzeit: 5 Stunden
Meine Dienstleistungen

Dieline-Design
I will create professional artioscad dielines and 3d packaging
4 Bewertungen
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kimscopelliti

Vereinigte Staaten
Wendi really understood what I was looking for in packaging and went the extra mile to deliver a very professional design that met my goals. I look forward to working with him again in the near future. Thank you, Wendi!
Hilfreich?
shivismagee

Großbritannien
Antwort des Freelancers
Hilfreich?

mofado77
Wiederkehrender Kunde

Kanada
Hilfreich?
anasumardi

Indonesien
Perfect dieline for products with minimal height. Efficient and cost-effective.
Hilfreich?