k
kauan_agertt

Kauan A

@kauan_agertt

Electronics and PCB Design Engineer

Brasilien
Portugiesisch, Englisch
Einige Informationen werden in englischer Sprache angezeigt.
Über mich
Hardware Engineer specialized in developing functional, optimized, and production-ready PCBs. Expert in KiCad, schematic capture, PCB routing, and hardware reverse engineering. I strictly follow Signal Integrity best practices and DFM (Design for Manufacturing) constraints to ensure your boards are manufactured flawlessly on the first run.... Mehr lesen

Kompetenzen

k
kauan_agertt
Kauan A
offline • 

Meine Dienstleistungen

Leiterplatten (PCB)
I will be your electronics engineer for pcb design

Portfolio

Arbeitserfahrung

TECDET

Electronics Design Engineer

TECDET • Vollzeit

Jun 2024 - Present2 yrs 3 mos

As an Embedded Systems & Hardware Design Engineer, I develop robust, production-grade electronic circuits and printed circuit boards for demanding real-world applications. My work spans high-precision analog signal conditioning, embedded integration, and automated manufacturing validation. Key engineering highlights include: High-Precision Signal Conditioning: Engineered complete analog front-end boards for traffic monitoring and vehicle axle detection. Filtered and amplified raw signals from piezoelectric sensors using low-noise operational amplifiers paired with high-resolution data acquisition pipelines. Embedded Hardware Architecture: Designed integrated PCB layouts around industry-standard microcontrollers, including ESP32 and ATmega328P architectures, combining microcontrollers, peripheral interfaces, power regulation, and sensor suites onto unified boards. Hardware-in-the-Loop Simulation & Validation: Built custom automated testing hardware using optocouplers and MCU-driven frequency generation to accurately simulate roadside vehicle speeds, enabling rigorous lab validation of measurement hardware before deployment. System Integration & Board Consolidation: Streamlined modular multi-board assemblies into consolidated single-board systems, reducing assembly overhead and improving thermal and electrical performance. Electromechanical Alignment: Applied 3D CAD modeling to verify footprint clearances, enclosure fitting, and connector placement, ensuring seamless mechanical-to-PCB integration.