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Eric
@eric_nem02
High Speed PCB Design Engineer, DDR4 DDR5, PCIe Gen5
Frankreich
Deutsch, Englisch
Über mich
I am a hardware engineer specializing in complex, high-speed multilayer PCB design and Signal Integrity (SI/PI) analysis. From advanced microcontrollers (ESP32, STM32, RP2350) to ultra-fast digital interfaces, I deliver production-ready hardware optimized for EMI/EMC compliance and manufacturability. Using industry-standard EDA tools like Altium Designer and KiCad, I transform complex schematics into reliable, high-performance physical layouts. Let's bring your cutting-edge hardware to life.
Kompetenzen
Eric
offline •
Durchschnittliche Antwortzeit: 1 Stunde
Meine Dienstleistungen
Leiterplatten (PCB)
I will design pcb design high speed altium pcb, ddr4 ddr5, pcie gen5, signal integrity
Eingebettete Systeme & Internet der Dinge
I will do arduino raspberry pi stm32 and esp32 embedded programming and iot projects
Arbeitserfahrung
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Senior Hardware & PCB Design Engineer
Fiverr • Freiberufler
Jan 2021 - Present • 5 yrs 6 mos
1. High-Speed Digital Layouts: Successfully routed complex 6-layer and multi-layer PCBs featuring dense BGA components, impedance-controlled routing, and tight length matching. 2. Signal & Power Integrity: Conducted pre- and post-layout SI/PI simulations to eliminate crosstalk, reflections, and power rail noise on critical high-speed buses. 3. RF & Wireless Integration: Designed and optimized RF/microwave circuits, including onboard microstrip antennas, LoRa (SX1276), Wi-Fi, and Bluetooth sub-systems. 4. Motor Control & Power Electronics: Developed robust power stages and gate drivers for high-power robotics and industrial automation systems. 5. Reverse Engineering & Codev: Performed comprehensive hardware reverse engineering and deep-dive PCB design reviews to identify signal bottlenecks and manufacturing risks.
Senior Hardware Design Engineer
Upwork • Freiberufler
May 2020 - Present • 6 yrs 2 mos
1. Designed 100+ multilayer PCBs (4–24 layers) 2. Developed DDR4/DDR5 memory subsystems for embedded platforms 3. Designed PCIe Gen4 and Gen5 high-speed interfaces 4. Performed signal integrity and power integrity optimization 5. Reduced EMI issues through advanced stackup and routing techniques 6. Delivered production-ready designs with high manufacturing yield 7. Created impedance-controlled designs for data rates above 32GT/s
